H301 Epoxy Electronic Potting Glue Waterproof Sealant (Hard) 600g

H301 is a rigid adhesive suitable for potting, power circuit boards, insulation, waterproofing applications. it boasts high strength, resistance to low temperatures, exceptional stability.

H593 compound, on the other hand, flexible ideal encapsulating protecting various components boards. offers excellent flexibility, temperature resistance, uv oxidation moisture, dust protection.

Both adhesives are environmentally friendly, non-toxic, odorless, safe use, providing secure stable solution your devices.

Product Details:

H301 epoxy potting compound

Component A: black liquid

Component B: Brown Liquid

Mixing ratio (group A:group B) weight ratio: 5:1

Curing hardness: 80D

Dielectric Strength 16-18

Temperature range -50~120°C

Curing time: Initial solidification after mixing: 2-3 hours

Full solid: 24 hours

Temperature has an effect on curing speed

The higher the temperature, the faster the curing

Total weight: 600g

Brand: QUINSON